PCB_PCB Manufacturer, PCB Supplier, PCB & PCBA-Sunthone Technology Circuit Co. Ltd.

PCB Assembly

Sunthone offers one-stop PCB and PCBA services, including PCB manufacturing, PCB assembly, components sourcing, stencils, cable assembly, final product assembly and testing.

Multilayer PCBs greatly increase the area available for the wiring with one or more conductor pattern inside the board. This is achieved by gluing (laminating) several double-sided boards together with insulating layers in between. The number of layers is referred to as the number of separate conductor patterns.

System Control PCBA

System Control PCBA

Type of Assembly: SMT, THT, hand soldering, mixed assembly. SMT Sides: single side SMT, double side SMT. Min Assembly Package: 0201 passive components
Components Packaging: tape, cut tape, tube, reel, loose parts
Testing: AOI, X-RAY, In-circuit Test, functional test, aging test
Mounting Precision: 0.1mm
Mounting Capacity: 2million points

Signal Coding & Decoding PCBA

Signal Coding & Decoding PCBA

Type of Assembly: SMT, THT, hand soldering, mixed assembly. Solder Type: RoHS and lead free solder, leaded solder, conformal coating. SMT Sides: single side SMT, double side SMT
Components Packaging: tape, cut tape, tube, reel, loose parts
Testing: AOI, X-RAY, In-circuit Test, functional test, aging test
Mounting Precision: 0.1mm
Mounting Capacity: 2million points

Motion Indication PCBA

Motion Indication PCBA

Type of Assembly: SMT, THT, hand soldering, mixed assembly
Solder Type: RoHS and lead free solder, leaded solder, conformal coating
SMT Sides: single side SMT, double side SMT
Min Assembly Package: 0201 passive components
Components Packaging: tape, cut tape, tube, reel, loose parts
Mounting Precision: 0.1mm
Mounting Capacity: 2million points

Power Control System PCBA

Power Control System PCBA

Type of Assembly: SMT, THT, hand soldering, mixed assembly. Solder Type: RoHS and lead free solder, leaded solder, conformal coating. SMT Sides: single side SMT, double side SMT
Min Assembly Package: 0201 passive components
Components Packaging: tape, cut tape, tube, reel, loose parts
Testing: AOI, X-RAY, In-circuit Test, functional test, aging test
Mounting Capacity: 2million points

Internet Connection PCBA

Internet Connection PCBA

Type of Assembly: SMT, THT, hand soldering, mixed assembly
Solder Type: RoHS and lead free solder, leaded solder, conformal coating
SMT Sides: single side SMT, double side SMT
Components Packaging: tape, cut tape, tube, reel, loose parts
Testing: AOI, X-RAY, In-circuit Test, functional test, aging test
Mounting Precision: 0.1mm
Mounting Capacity: 2million points

UPS Power Supply PCBA

UPS Power Supply PCBA

Type of Assembly: SMT, THT, hand soldering, mixed assembly
Solder Type: RoHS and lead free solder, leaded solder, conformal coating
SMT Sides: single side SMT, double side SMT
Min Assembly Package: 0201 passive components
Testing: AOI, X-RAY, In-circuit Test, functional test, aging test
Mounting Precision: 0.1mm
Mounting Capacity: 2million points

4-layer HASL PCB

4-layer HASL PCB

Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.25mm
Min hole size: 0.3mm
Surface finish: Lead free HASL
Specialty:
Application: Industrial Facilities

4-layer Immersion Gold PCB

4-layer Immersion Gold PCB

Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.2mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty:
Application: Power Supply

4-layer PCB

4-layer PCB

Material: FR-4
Layer: 4
Board thickness: 1.5mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.2mm
Surface finish: Immersion Gold
Specialty:
Application: Telecommunications

6-layer Immersion Gold PCB

6-layer Immersion Gold PCB

Material: FR-4
Layer: 6
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty:
Application: Industrial Facilities

6-layer HASL PCB

6-layer HASL PCB

Material: FR-4
Layer: 6
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.075/0.075mm
Min hole size: 0.2mm
Surface finish: Lead free HASL
Specialty: fine trace/clearance
Application: Industrial Facilities

10-layer Impedance PCB

10-layer Impedance PCB

tiesMaterial: FR-4
Layer: 10
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.075/0.075mm
Min hole size: 0.25mm
Surface finish: Lead free HASL
Specialty: Impedance Control + fine trace/clearance
Application: Industrial Facilities

Single-double Sided PCB

We work with our customer towarding success with superior quality PCBs provided at a low cost. We fully understand your need for high quality PCBs delivered on time to build your products. In addition, we want to lower your costs so your business endeavors are more profitable.
Doubled-sided PCB

Doubled-sided PCB
Material: FR-4
Layer: 2
Board thickness: 1.0mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.25mm
Min hole size: 0.2mm
Surface finish: Immersion Gold
Specialty: Plated Half-holes
Application: Communications
2-layer HASL PCB

2-layer HASL PCB
Material: FR-4
Layer: 2
Board thickness: 1.2mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.25mm
Surface finish: Lead free HASL
Specialty:
Application: GPS Terminals
White Solder Mask PCB

White Solder Mask PCB
Material: FR-4
Layer: 1
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.51/0.38mm
Min hole size: 0.762mm
Surface finish: Lead free HASL
Specialty:
Application: LED
2-layer Immersion Gold PCB

2-layer Immersion Gold PCB
Material: FR-4
Layer: 2
Board thickness: 2.0mm
Copper weight: 2Oz
Min trace/clearance: 0.51/0.38mm
Min hole size: 0.38mm
Surface finish: Immersion Gold
Specialty: Application: Toys
Plated Edges PCB

Plated Edges PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.25mm Surface
finish: Immersion Gold
Specialty: Plated Edges
Application: Toys
2-layer PCB

2-layer PCB
Material: FR-4
Layer: 2 Board
thickness: 2.0mm Copper
weight: 1Oz Min trace/clearance: 0.15/0.15mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty:
Application: SPA Equipments

High Frequency PCB

High frequency circuit boards are developing with the increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies.
Doubled-sided High Frequency

Doubled-sided High Frequency
Material: Rogers
Layer: 2
Board thickness: 0.8mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.25mm
Surface finish: immersion Gold
Specialty: Rogers material + high frequency
6-layer High Frequency PCB

6-layer High Frequency PCB
Material: Rogers + FR-4
Layer: 6
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.2mm
Surface finish: immersion Gold
Specialty: Rogers material + high frequency
Application: Telecommunications
8-layer High Frequency PCB

8-layer High Frequency PCB
Material: Rogers + FR-4
Layer: 8
Board thickness: 2.4mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.25mm
Surface finish: Lead free HASL
Specialty: Rogers material + high frequency
Application: Telecommunications
2-layer High Frequency PCB

2-layer High Frequency PCB
Material: Rogers
Layer: 2
Board thickness: 0.5mm
Copper weight: 1Oz
Min trace/clearance: 0.38/0.38mm
Min hole size: 0.51mm
Surface finish: OSP
Specialty: Rogers material + high frequency
Application: Telecommunications
2-layer Rogers PCB

2-layer Rogers PCB
Material: Rogers
Layer: 2
Board thickness: 0.5mm
Copper weight: 1Oz
Min trace/clearance: 0.51/0.38mm
Min hole size: 0.51mm
Surface finish: OSP
Specialty: Rogers material + high frequency
Application: Telecommunications
High Frequency PCB

High Frequency PCB
Material: Rogers
Layer: 2
Board thickness: 0.5mm
Copper weight: 1Oz
Min trace/clearance: 0.51/0.38mm
Min hole size: 0.38mm
Surface finish: OSP
Specialty: Rogers material + high frequency
Application: Telecommunications

Impedance PCB

Impedance is the sum of the resistance and reactance of an electrical circuit expressed in Ohms. The resistance being the opposition to current flow present in all materials.
2-layer Impedance HASL PCB

2-layer Impedance HASL PCB
Material: FR-4
Layer: 2
Board thickness: 1.2mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.2mm
Min hole size: 0.3mm
Surface finish: Lead free HASL
Specialty: Impedance controlled
Application: Industrial Facilities
4-layer Impedance PCB

4-layer Impedance PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty: Impedance controlled
Application: Industrial Facilities
8-layer Impedance PCB

8-layer Impedance PCB
Material: FR-4
Layer: 8
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty: Impedance controlled + BGA
Application: Industrial Facilities
2-layer Impedance PCB

2-layer Impedance PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty: Impedance controlled + BGA
Application:
6-layer Impedance PCB

6-layer Impedance PCB
Material: FR-4
Layer: 6
Board thickness: 1.0mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.2mm
Surface finish: Immersion Gold
Specialty: Impedance controlled + BGA
Application: Telecommunications
2-layer Impedance & BGA PCB

2-layer Impedance & BGA PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.25mm
Surface finish: OSP
Specialty: Impedance controlled + BGA
Application:

Heavy Copper PCB

Heavy copper does not have a set definition per IPC. However, the industry generally accepts the definition to be the use of 3 ounce copper or higher in inner and/or outer layers of a printed circuit or power distribution board.
4-layer Thick Copper PCB

4-layer Thick Copper PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 2Oz
Min trace/clearance: 0.25/0.2mm
Min hole size: 0.5mm
Surface finish: Immersion Gold
Specialty: Heavy Copper Application: Power Supply
4-layer Heavy Copper PCB

4-layer Heavy Copper PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 2Oz
Min trace/clearance: 0.25/0.25mm
Min hole size: 0.38mm
Surface finish: Lead free HASL
Specialty: Heavy Copper
Application: Power Supply
4Oz Copper PCB

4Oz Copper PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 4Oz
Min trace/clearance: 0.30/0.25mm
Min hole size: 0.4mm Surface finish: Lead free HASL
Specialty: Heavy Copper
Application: Power Supply
2-layer Heavy Copper PCB

2-layer Heavy Copper PCB
Material: FR-4
Layer: 2
Board thickness: 2.0mm
Copper weight: 4Oz
Min trace/clearance: 0.30/0.25mm
Min hole size: 0.5mm
Surface finish: Lead free HASL
Specialty: Heavy Copper
Application: Power Supply
Heavy Copper PCB

Heavy Copper PCB
Material: FR-4
Layer: 2
Board thickness: 2.0mm
Copper weight: 3Oz
Min trace/clearance: 0.25/0.3mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Heavy Copper
Application: Power Supply
3Oz Copper PCB

3Oz Copper PCB
Material: FR-4
Layer: 2
Board thickness: 2.0mm
Copper weight: 3Oz
Min trace/clearance: 0.38/0.38mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Heavy Copper
Application: Power Supply

Hard Gold PCB

Hard Gold is used where either a very resilient surface finish is required, or in the case of edge connectors a wear resistant oxide free finish is required.
2-layer Gold Plating PCB

2-layer Gold Plating PCB
Material: FR-4
Layer: 2
Board thickness: 1.2mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.3mm
Surface finish: Plating Gold
Specialty: Hard Gold Plating
Application: Household Articles
Gold Plating PCB

Gold Plating PCB
Material: FR-4
Layer: 4
Board thickness: 1.2mm
Copper weight: 1Oz
Min trace/clearance: 0.51/0.38mm
Min hole size: 0.38mm
Surface finish: Plating Gold
Specialty: Hard Gold Plating
Application: Household Articles
4-layer Plating Gold PCB

4-layer Plating Gold PCB
Material: FR-4
Layer: 4
Board thickness: 1.0mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.25mm
Surface finish: Plating Gold
Specialty: Hard Gold Plating
Application: Consumer electronics
2-layer Plating Gold PCB

2-layer Plating Gold PCB
Material: FR-4
Layer: 2
Board thickness: 1.5mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.2mm
Surface finish: Plating Gold
Specialty: Hard Gold Plating
Application: Consumer electronics
Plating Gold PCB

Plating Gold PCB
Material: FR-4
Layer: 2
Board thickness: 1.0mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.25mm
Min hole size: 0.2mm
Surface finish: Plating Gold
Specialty: Hard Gold Plating
Application: Consumer electronics
Remote Control PCB

Remote Control PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.31/0.25mm
Min hole size: 0.5mm
Surface finish: Plating Gold + Carbon Ink
Specialty: Hard Gold Plating
Application: Remote Control

Gold Finger PCB

Gold Finger PCB refers to those PCBs with finger-like pads applying plated gold surface finish, and they are usually used as edge-connectors.
4-layer Gold Finger PCB

4-layer Gold Finger PCB
Material: FR-4
Layer: 4
Board thickness: 2.0mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.25mm
Surface finish: Immersion Gold + Gold Finger
Specialty: Gold Finger
Application:
4-layer Gold Finger PCB

4-layer Gold Finger PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.2mm
Surface finish: Lead free HASL + Gold Finger
Specialty: Fine Gold Fingers and Fine clearance between fingers
6-layer Gold Finger PCB

6-layer Gold Finger PCB
Material: FR-4
Layer: 6
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.2mm
Surface finish: Lead free HASL + Gold Finger
Specialty: Fine Gold Fingers and Fine clearance between fingers
Gold Finger PCB

Gold Finger PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.38/0.25mm
Min hole size: 0.3mm
Surface finish: Immersion Gold + Gold Finger
Specialty: Gold Fingers
Application:
2-layer Gold Finger PCB

2-layer Gold Finger PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.38/0.38mm
Min hole size: 0.51mm
Surface finish: Lead free HASL + Gold Finger
Specialty: Gold Fingers
Application: counter card

Blind-buried Vias PCB

Blind Vias start on an outer layer but terminate on an inner layer. Buried Vias exist only between inner layers and do not begin or terminate on an outer layer.
Blind-buried Via PCB

Blind-buried Via PCB
Material: FR-4
Layer: 6
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.2mm Surface finish: Immersion Gold
Specialty: Blind and Buried Vias + BGA + Impedance Control
Application: Telecommunications
8-layer Blind-buried Via PCB

8-layer Blind-buried Via PCB
Material: FR-4
Layer: 8
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.2mm
Surface finish: Immersion Gold + Gold Fingers
Specialty: Blind and Buried Vias + BGA + Impedance Control + Gold Fingers
Application: Industrial Computer
8-layer Computer Mother Board

8-layer Computer Mother Board
Material: FR-4
Layer: 8
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.2mm
Surface finish: Immersion Gold
Specialty: Blind and Buried Vias + BGA + Impedance Control
Application: Industrial Computer
6-layer Blind-buried Via PCB

6-layer Blind-buried Via PCB
Material: FR-4
Layer: 6
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.2mm
Surface finish: Lead free HASL
Specialty: Blind and Buried Vias + BGA
Application: Industrial Facilities
6-layer Carbon Ink PCB

6-layer Carbon Ink PCB
Material: FR-4 Tg=170
Layer: 6
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.25mm
Surface finish: Immersion Gold + Carbon Ink
Specialty: Blind and Buried Vias
Application: Medical Facilities
4-layer Blind-buried Via PCB

4-layer Blind-buried Via PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.51/0.38mm
Min hole size: 0.51mm
Surface finish: Immersion Gold
Specialty: blind and buried vias
Application:

Plated Half-holes PCB

Plated half-holes are predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. E.g. the combination of complex microcontroler modules with common, individually designed PCBs.
2-layer Half-holes Plated PCB

2-layer Half-holes Plated PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 1.5/1.5mm
Min hole size: 0.76mm
Surface finish: Immersion Gold
Specialty: Plated Half-holes
Application: Power Supply
4-layer Half-holes Plated PCB

4-layer Half-holes Plated PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty: Plated Half-holes
Application: Communications
4-layer Half-holes PCB

4-layer Half-holes PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.2mm
Surface finish: Immersion Gold
Specialty: Plated Half-holes
Application: Communications
2-layer Plated Half-holes PCB

2-layer Plated Half-holes PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.25mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Plated Half-holes
Application: Communications
Plated Half-holes PCB

Plated Half-holes PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.25mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Plated Half-holes
Application: Household Articles
4-layer Plated Half-holes PCB

4-layer Plated Half-holes PCB
Material: FR-4
Layer: 4
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.25/0.25mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Plated Half-holes
Application: Communications

Bonding PCB

PCB Manufacturer, PCB Supplier, PCB & PCBA,Bonding PCB board manufacturer in china.With excellent performance on quality and lead time, Sunthone can be your best partner, either you are a factory or trader from east or west.
2-layer Bonding Pads PCB

2-layer Bonding Pads PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Bonding Pads
Application: LCD module products
Bonding PCB

Bonding PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Bonding Pads
Application: LCD module products
Module PCB

Module PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Bonding Pads
Application: LCD module products
LCD PCB

LCD PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.15mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Bonding Pads
Application: LCD module products
Bonding Pads PCB

Bonding Pads PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.2mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Bonding Pads
Application: LCD module products
LCD Module PCB

LCD Module PCB
Material: FR-4
Layer: 2
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.3mm
Surface finish: Immersion Gold
Specialty: Bonding Pads
Application: LCD module products

Unconventional Thickness PCB

PCB Manufacturer, PCB Supplier, PCB & PCBA,Unconventional Thickness PCB board manufacturer in china.The company focuses on major markets including Domestic Market, America, Europe, Oceania, Southeast Asia and Middle East.
10-layer Thick PCB

10-layer Thick PCB
Material: FR-4
Layer: 10
Board thickness: 3.0mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.3mm
Surface finish: Lead free HASL
Specialty:
Application: Industrial Facilities
Thick PCB

Thick PCB
Material: FR-4
Layer: 2
Board thickness: 3.0mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.3mm
Surface finish: Lead free HASL
Specialty:
Application: Industrial Facilities
2-layer Thick PCB

2-layer Thick PCB
Material: FR-4
Layer: 2
Board thickness: 3.0mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.3mm
Surface finish: Lead free HASL
Specialty:
Application: Industrial Facilities
2-layer Thin PCB

2-layer Thin PCB
Material: FR-4
Layer: 2
Board thickness: 0.4mm
Copper weight: 1Oz
Min trace/clearance: 0.1/0.1mm
Min hole size: 0.2mm Surface finish: Immersion Gold
Specialty: Small Board Thickness
Application: Consumer Electronics
Thin PCB

Thin PCB
Material: FR-4
Layer: 2
Board thickness: 0.5mm
Copper weight: 1Oz
Min trace/clearance: 0.2/0.15mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty: Small Board Thickness
Application: Consumer Electronics
4-layer Thin PCB

4-layer Thin PCB
Material: FR-4
Layer: 4
Board thickness: 0.6mm
Copper weight: 1Oz
Min trace/clearance: 0.15/0.15mm
Min hole size: 0.25mm
Surface finish: Immersion Gold
Specialty: Small Board Thickness
Application: Consumer Electronics

Aluminium-based PCB

Aluminium-based circuit boards are an excellent alternative to standard circuit boards, if the circuit boards are exposed to large mechanical loads, or a high level of dimensional stability is required, or high temperatures must be conducted away from power components or LED's.
2-layer Aluminium-based PCB

2-layer Aluminium-based PCB
Material: Aluminium
Layer: 1
Board thickness: 1.6mm
Copper weight: 1Oz
Min trace/clearance: 1.5/2.0mm
Min hole size: 2.0mm
Surface finish: Lead free HASL
Specialty: Aluminium Core
Application: LED Lightning
Thick Aluminium-based PCB

Thick Aluminium-based PCB
Material: Aluminium
Layer: 1
Board thickness: 3.0mm
Copper weight: 1Oz
Min trace/clearance: 3.0/2.5mm
Min hole size: 3.81mm
Surface finish: Lead free HASL
Specialty: Aluminium Core + Counter-sink Holes
Application: LED Lightning
Thick Aluminium PCB

Thick Aluminium PCB
Material: Aluminium
Layer: 1
Board thickness: 3.0mm
Copper weight: 1Oz
Min trace/clearance: 2.5/1.0mm
Min hole size: 2.54mm
Surface finish: Immersion Gold
Specialty: Aluminium Core + Counter-sink Holes
Application: LED Lightning
1-layer Aluminium-based PCB

1-layer Aluminium-based PCB
Material: Aluminium
Layer: 1
Board thickness: 1.5mm
Copper weight: 1Oz
Min trace/clearance: 1.5/1.0mm
Min hole size: 2.54mm
Surface finish: Lead free HASL
Specialty: Aluminium Core
Application: LED Lightning
1-layer Aluminium PCB

1-layer Aluminium PCB
Material: Aluminium
Layer: 1
Board thickness: 1.5mm
Copper weight: 1Oz
Min trace/clearance: 1.5/1.5mm
Min hole size: 3.81mm
Surface finish: Lead free HASL
Specialty: Aluminium Core
Application: LED Lightning
Aluminium-based PCB

Aluminium-based PCB
Material: Aluminium
Layer: 1
Board thickness: 1.5mm
Copper weight: 1Oz
Min trace/clearance: 1.0/1.0mm
Min hole size: 3.81mm
Surface finish: Lead free HASL
Specialty: Aluminium Core
Application: LED Lightning

It is usually even and includes the two outer layers. Most main boards have between 4 and 8 layers, but PCBs with almost 100 layers can be made. Large super computers often contain boards with extremely many layers, but since it is becoming more efficient to replace such computers with clusters of ordinary PCs, PCBs with a very high layer count are less and less used. Since the layers in a PCB are laminated together it is often difficult to actually tell how many there are, but if you inspect the side of the board closely you might be able count them.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

We work with our customer towarding success with superior quality PCBs provided at a low cost. We fully understand your need for high quality PCBs delivered on time to build your products. In addition, we want to lower your costs so your business endeavors are more profitable.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

The reactance is the opposition to current flow resulting from the effect of the inherent capacitance and inductance of the conductor interacting with changes in voltage and current. In DC circuits there is no reactance and the resistance of copper conductors is typically insignificant.

The typical design considerations involved in the determination for controlling the impedance are the strength of the signals involved, the susceptibility of the circuit to noise and signal distortion, the criticality of signal timing and the speed at which the signal’s source is attempting to force a change in voltage and/or current.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Heavy copper can be used for a variety of purposes, including, but not limited to, high power distribution,heat dissipation, planar transformers, and power convertors.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Unlike electroless finishes, being an electrolytic process, an electric current is required to plate the gold onto the board. The thickness of the gold coating can be easily controlled by the plating current and plating time. The normal thickness of gold coating is 1-3 micros, and Sunthone is capable in fabricating maximum 50 micros of gold coating thickness.
Hard gold can also be used as a total circuit board finish, in which case the cheapest production route can be to photo print a negative image, plate the remaining exposed copper with gold, then strip off the photo resist and use the gold as an etch resist.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Electroless gold gives excellent solderability, but the chemical deposition process means that it is too soft and too thin to withstand repeated abrasion. Electroplated gold is thicker and harder making it ideal for edge-connector contacts for PCBs which will be repeatedly plugged in and removed.

Gold Finger PCBs normally have to bevel the edge connectors to ensure easy insertion. Bevelling can be specified in the order details if there are any special instructions.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Blind and buried vias help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today’s fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Additional applications are display, HF or ceramic modules which are soldered to the base printed circuit board.

The board-on-board PCBs therefore need plated half-holes, which serve as SMD connection pads. Through directly connecting the PCBs together, the whole system is considerably thinner than a comparable connection with multi-pin connectors.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

The thermal conductivity assisted by the aluminium cores in the circuit boards makes higher packing densities, longer operating times, and improved security against failure possible, such as for LED technology and for high power transistors.

Additional application areas for this technology include: high current application, power LED's, SMD and power circuit boards. The high thermal conductivity permits a quick and effective transfer of the heat produced.

Technical Capacity
Layers	1-24 layers	Min Board Thickness(2-layer)	0.2mm
Max Panel Size	635×1100mm	Min Board Thickness(4-layer)	0.4mm
Max Copper	12Oz	Min Inner-layer Thickness	0.1mm
Min Trace	0.075mm	Min Pad Ring	0.1mm
Min Clearance	0.075mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.15mm	Min Hole Size Tolerance	±0.05mm
Board Twist	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Surface Finish	HAL, HASL, Immersion Gold, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based
Standard Lead Time	2-layer samples in 3 days only 4-layer samples in 5 days only

System Control PCBA

Signal Coding & Decoding PCBA

Motion Indication PCBA

Power Control System PCBA

Internet Connection PCBA

UPS Power Supply PCBA

4-layer HASL PCB

4-layer Immersion Gold PCB

4-layer PCB

6-layer Immersion Gold PCB

6-layer HASL PCB

10-layer Impedance PCB

Doubled-sided PCB

2-layer HASL PCB

White Solder Mask PCB

2-layer Immersion Gold PCB

Plated Edges PCB

2-layer PCB

Doubled-sided High Frequency

6-layer High Frequency PCB

8-layer High Frequency PCB

2-layer High Frequency PCB

2-layer Rogers PCB

High Frequency PCB

2-layer Impedance HASL PCB

4-layer Impedance PCB

8-layer Impedance PCB

2-layer Impedance PCB

6-layer Impedance PCB

2-layer Impedance & BGA PCB

4-layer Thick Copper PCB

4-layer Heavy Copper PCB

4Oz Copper PCB

2-layer Heavy Copper PCB

Heavy Copper PCB

3Oz Copper PCB

2-layer Gold Plating PCB

Gold Plating PCB

4-layer Plating Gold PCB

2-layer Plating Gold PCB

Plating Gold PCB

Remote Control PCB

4-layer Gold Finger PCB

4-layer Gold Finger PCB

6-layer Gold Finger PCB

Gold Finger PCB

2-layer Gold Finger PCB

Blind-buried Via PCB

8-layer Blind-buried Via PCB

8-layer Computer Mother Board

6-layer Blind-buried Via PCB

6-layer Carbon Ink PCB

4-layer Blind-buried Via PCB

2-layer Half-holes Plated PCB

4-layer Half-holes Plated PCB

4-layer Half-holes PCB

2-layer Plated Half-holes PCB

Plated Half-holes PCB

4-layer Plated Half-holes PCB

2-layer Bonding Pads PCB

Bonding PCB

Module PCB

LCD PCB

Bonding Pads PCB

LCD Module PCB

10-layer Thick PCB

Thick PCB

2-layer Thick PCB

2-layer Thin PCB

Thin PCB

4-layer Thin PCB

2-layer Aluminium-based PCB

Thick Aluminium-based PCB

Thick Aluminium PCB

1-layer Aluminium-based PCB

1-layer Aluminium PCB

Aluminium-based PCB