| ITEM | Capability |
| Month Capability | 1000types/month,8,000sqm/month |
| Board Material | Standard FR4: Shengyi, ITEQ, KB, GDM High TG: S1000-2, IT180 |
| Surface treatment | OSP, HASL, LF-HASL, ENIG(Chem. Gold), Immersion Tin, Immersion silver, Plating hard gold, Gold fingers,Flash gold, ENEPIG |
| Tolerance | Board thickness tolerance 1.0mm: +/-0.1mm 1.0mm-2.0mm: +/-10% >2.0mm: +/-8% |
| Hole diameter tolerance PTH: +/-0.075mm NPTH:+/-0.05mm | |
| Hole location tolerance: +/-0.075mm | |
| Outline tolerance: < 100mm: +/-0.1mm 100mm-300mm: +/-0.15mm >300mm: +/-0.2mm | |
| Technical Specification | Layers: 1-24 layers |
| Min line width/space: 0.075/0.075mm | |
| Min hole: 0.15mm (mechanical drilling) 0.1mm (laser drilling) | |
| Min pad ring: 0.1mm | |
| Max copper thickness: 12oz | |
| Max board size:1-2 layers: 635 X 1100mm Multilayers: 500 X 1100mm | |
| Board thickness: 2-layers: 0.2-7.0mm Multi-layers: 0.4-7.0mm Inner layers: 0.1mm | |
| Board warpage: ≤1° | |
| Min solder mask bridge: 0.08mm | |
| Aspect Ration: 8:1 | |
| Plugging Vias capability: 0.2-0.8mm | |
| Au, Ni thickness control: 1. Chem gold: Au:1-10u” 2. Gold fingers: Au:1-150u” 3. Flash gold: Au:1-10u” 4. Hard gold:Au:1-150u” 5. Ni thickness:50-1000u” 6. ENEPIG: Au:1-8u”,Pd:2-5u |
Auto Cutting Machine
Drilling Machine
CNC Routing Machine
Pressing
X-ray Machine
Plating Line
Etching Line
AOI Scanning
AOI Inspection
Silkscreen
Dust-free Room
Auto Film Exposure
Auto Gold Immersion Line
Waste Handling 1
Waste Handling 2
E-test(E-fixture Test)
Flying Probe Test
Flying Probe Test(High Speed)
