Embedded Devices
The D-55 Embedded Devices Process Implementation Subcommittee discussed comments received during the recent balloting of IPC-7092, Design and Assembly Process Implementation for Embedded Components Document passed the ballot process, but some reservations associated with one negative ballot were reviewed and dispositions provided. A final resolution acceptance meeting is required by procedure, which will either result in a unanimous acceptance or publication with one dissenting vote before January 1, 2015.
Printed Electronics
The D-60 Printed Electronics Committee welcomed new additions to the leadership of this active general committee overseeing printed electronics standards development as Raj Kumar agreed to take the chair position, freeing Dan Gamota to step back to a vice-chair position.
The D-61 Printed Electronics Design Subcommittee continued to gather input for revision A of IPC-2291,Design Guidelines for Printed Electronics. The group has set a preliminary release date of fall 2015. Dr. Hirofumi Matsumoto has been added to the D61 leadership group as cice-chair to facilitate design needs exchange with the JPCA “mirror” committee.
The D-62 Printed Electronics Base Materials Substrates Subcommittee is preparing significant expansions in scope to IPC/JPCA-4921 including new information on glass and glass-like substrates, many additional plastic film alternatives, and an entirely new cellulosics section. Target for publication of revision A: 1Q 2015.
The D-63 Printed Electronics Functional Materials Subcommittee continued to gather material for IPC/JPCA 4591A, expanded the scope to include information on insulatives, optically-active, and possible semi-conductive functional materials. The expanded scope may delay the proposed 1Q 2015 publication date until 3Q 2015.
The D-64 Printed Electronics Final Assembly Subcommittee prepared a working draft of IPC-6901,Performance Requirements for Printed Electronics Assemblies for review. An additional co-chair is needed, but a vice chair has been added to help reduce the load on the existing chair, whose work duties force a pullback from IPC activities.
The D-65 Printed Electronics Test Method Development and Validation Subcommittee has begun independent activities with a number of new committee participants. The first draft of one test method subsection (flexibility evaluations) has been received and is under committee review. Murad Kurwa, Flextronics, is the new co-chair sharing the workload with Dan Gamota, Jabil Circuit.
The D-66 Printed Electronics Processes Subcommittee continues to work closely with the JPCA “mirror committee” to refine “best practices/implementation guideline” draft for printed electronics processing. Preliminary goal for initial release: fall 2015.
