PC–Association Connecting Electronics Industries presented Committee Leadership, Special Recognition, and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through service on IPC committees. 
For their leadership of the D-12 Flexible Circuits Specifications Subcommittee that developed IPC-6013C, Qualification and Performance Specification for Flexible Printed Boards, Nick Koop, TTM Technologies and Mahendra Gandhi, Northrop Grumman Aerospace Systems, were honored with a Committee Leadership Award. For their contributions to IPC-6013C, Lance Auer, Raytheon Missile Systems; Scott Bowles, L-3 Fuzing and Ordnance Systems; Steven Bowles, Viasystems Group, Inc.; Denise Chevalier, Amphenol Printed Circuits, Inc.; Sidney Cox, DuPont; Mark Finstad, Flexible Circuit Technologies, Inc.; Tom Gardeski, Gemini Sciences, LLC; Cliff Maddox, Boeing Company; Chris Mahanna, Robisan Laboratory Inc.; Steven Nolan, Lockheed Martin Mission Systems & Training; and Robert Sheldon, Pioneer Circuits Inc., earned a Distinguished Committee Service Award.
For their leadership of the 3-12d Woven Glass Reinforcement Task Group that developed IPC-4412B, Specification for Finished Fabric Woven from “E” Glass for Printed Boards, Mike Bryant, BGF Industries, Inc. and Douglas Eng, PPG Industries Inc., received a Committee Leadership Award. For their contributions to IPC-4412B, Tab Bates, JPS Composite Materials Corp.; Silvio Bertling, Circuit Foil Trading, Inc.; Curtis Carter, Saint-Gobain Vetrotex America; Terry Fischer, Hitachi Chemical Co. America, Ltd.; Scott Hinaga, Cisco Systems Inc.; Scott Northrup, AGY; Antonio Senese, Panasonic Electric Works; Douglas Sober, Shengyi Technology Co. Ltd.; Shinya Takahashi, Nittobo; and Dan Welch, Arlon Materials for Electronics, earned a Distinguished Committee Service Award.
For their leadership of the 5-24c Solder Alloy Task Group that developed IPC J-STD-006C, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications, a Committee Leadership Award went to Jennie Hwang, Ph.D., Sc.D., H-Technologies Group and David Adams, Rockwell Collins . For exceptional contributions to IPC JSTD-006C, Trevor Bowers, Adtran Inc. and Mitchell Holtzer, Alpha, earned a Special Recognition Award. Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Derek Daily, Senju Comtek; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Rigo Garcia, NASA Goddard Space Flight Center; Renee Michalkiewicz, Trace Laboratories – Baltimore; Celine Puechagut, Inventec Performance Chemicals; Jeannette Plante, NASA Goddard Space Flight Center; Brook Sandy-Smith, Indium Corporation of America; Bob Teegarden, Honeywell International – Torrance; Karen Tellefsen, Alpha; and Linda Woody, Lockheed Martin Missile & Fire Control, earned a Distinguished Committee Service Award for their contributions to IPC J-STD-006C.
