A. Cut Lamination
a-1 Sheets Cutting
a-2 Panel(Shear material to Size)
B. Drilling
b-1 Inner Layer Drilling
b-2 Outer Layer Drilling
b-3 2nd Drilling
b-4 Laser Drilling (Laser Ablation )
b-5 Blind & Buried Hole Drilling
C. Photo Process(D/F)
c-1 Pretreatment
c-2 Dry Film Lamination
c-3 Exposure
c-4 Developing
c-5 Etching
c-6 Stripping
c-7 Touch-up
c-8 Chemical Milling
c-9 Selective Gold Dry Film Lamination
c-10 Developing
c-11 Stripping
D. Lamination
d-1 Black Oxide Treatment
d-2 Microetching
d-3 eyelet
d-4 Lay up
d-5 Lamination
d-6 Post Treatment
d-7 Black Oxide Removal
d-8 spot face
d-9 resin flush removal
E. Copper Reduction
e-1 Copper Reduction
F. Horizontal Electrolytic Plating
f-1 Horizontal Electro-Plating (Panel Plating)
f-2 Tin-Lead Plating (Pattern Plating)
f-3 Less than 1 mil Thickness
f-4 More than 1 mil Thickness
f-5 Belt Sanding
f-6 Tin-Lead Stripping
f-7 Microsection
G. Plug Hole
g-1 Ink Print
g-2 Precure
g-3 Scrub
g-4 Postcure
H. Solder Mask
h-1 Printing Top Side
h-2 Printing Bottom Side
h-3 Spray Coating
h-4 Pretreatment
h-5 Precure
h-6 Exposure
h-7 Develop
h-8 Postcure
h-9 UV Cure
h-10 Printing of Legend
h-11 Pumice(Wet Blasting)
h-12 Peelable Solder Mask
I . Gold plating
i-1 Gold Finger
i-2 Soft Ni/Au Plating
i-3 Immersion Ni/Au (Electroless Ni/Au)
J. Hot Air Solder Leveling
j-1 Horizontal Hot Air Solder Leveling
j-2 Vertical Hot Air Solder Leveling
j-3 Super Solder
j-4.Solder Bump
K. Profile(Form)
k-1 N/C Routing (Milling)
k-2 Punch
k-3 Cleaning & Backing
k-4 V-Cut(V-Scoring)
k-5 Beveling of G/F
L. Electrical Testing (Continuity & Insulation Testing)
l-1 AOI Inspection
l-2 Verified & Repaired
l-3 Universal Tester
l-4 Dedicated Tester
l-5 Flying Probe
M. Final Visual Inspection
m-1 Warpage Remove
m-2 X-Out Marking
m-3 Packing & shipping/p>
